Si-photonics based passive device packaging and module performance

Advanced Module Packaging Method

Abstract An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly structures on large glass substrates using LCD manufacturing equipment. Trace widths of 5 microns and a trace pitch of 10 microns are achievable on flexible substrates as large as 1800 x 1500 mm. Back planes for d...

Monolithically Integrated Ge-on-Si Active Photonics

Monolithically integrated, active photonic devices on Si are key components in Si-based large-scale electronic-photonic integration for future generations of high-performance, low-power computation and communication systems. Ge has become an interesting candidate for active photonic devices in Si photonics due to its pseudo-direct gap behavior and compatibility with Si complementary metal oxide...

RF Performance of Layer-Structured Passive Millimeter-wave Imaging Module

Simple configuration and broadband characteristic are required for RF module in passive millimeter-wave imaging. We propose a layer-structured imaging module for simple structure, low profile and easy manufacturing [1]. This module is composed of lens antenna and detector module as shown in Fig.1. Lens and feeding horn antenna are designed to realize high-gain lens-antenna which operates over b...

Validating Medical Device Packaging

Trajectory-Based Indoor Device-Free Passive Tracking

Device-free passive (DfP) localization is proposed to localize human subjects indoors by observing how the subject disturbs the pattern of the radio signals without having the subject wear a tag. In our previous work, we have proposed a probabilistic classification based DfP technique, which we call PC-DfP in short, and demonstrated that PC-DfP can classify which cell (32 cells in total) is occ...